Mode Matching Analysis and Design of Substrate Integrated Waveguide Components

dc.contributor.authorKordiboroujeni, Zamzam
dc.contributor.supervisorBornemann, J. of Electrical and Computer Engineeringen_US of Philosophy Ph.D.en_US
dc.description.abstractThe advent of Substrate Integrated Circuit (SIC) technology, and specifically Substrate Integrated Waveguide (SIW) technology has made it feasible to design and fabricate low loss and high quality factor (Q-factor) microwave and millimeter wave structures on a compact and integrable layout and at a low cost. The SIW structure is the planar realization of the conventional rectangular waveguide (RWG). In this technology, the side walls of the waveguide are replaced with two rows of metallic vias, which are connecting two conductor sheets, located at the top and bottom of a dielectric slab. The motivation for this thesis has been to develop an analytical method to efficiently analyze SIW structures, and also design different types of passive microwave components based on this technology. As SIW structures are imitating waveguide structures in a planar format, the field distributions inside these structures are very close to those in waveguides. However, due to the very small substrate height in conventional planar technologies, and also the existence of a row of vias, instead of a solid metallic wall, there is a reduced set of modes in SIW compared to regular waveguide. This fact has given us an opportunity to deploy efficient modal analysis techniques to analyze these structures. In this thesis, we present a Mode Matching Techniques (MMT) approach for the analysis of H-plane SIW structures. One of the areas of application, which can significantly benefit from having an efficient analytical method, is designing and optimizing new circuits. Having such an analytical tool, which is faster than commercially available field solvers by an order of magnitude, new components can be designed, analyzed and optimized in a fast and inexpensive manner. Based on this technique, various types of passive microwave components including filters, diplexers, power dividers and couplers, some of which are among the first to be reported in SIW technology, are designed and analyzed in this thesis. Also based on this technique, the most accurate formula for the effective waveguide width of the SIW is presented in this thesis. In order to provide means to excite and measure SIW components, transitions between these structures and other planar topologies like microstrip and coplanar waveguide (CPW) are needed. More importantly, low-reflection transitions to microstrip are required to integrate SIW circuits with active components, and therefore it is vital to provide low-reflection transitions so that the component design is independent of the influences of the transitions. In this thesis, a new wideband microstrip-to-SIW transition, with the lowest reported reflection coefficient, is also introduced.en_US
dc.identifier.bibliographicCitation1. J. Bornemann, F. Taringou, and Z. Kordiboroujeni. A mode-matching approach for the analysis and design of substrate-integrated waveguide components. Frequenz - J. of RF/Microwave Engr., Photonics and Communications, 65:287-292, September 2011.en_US
dc.identifier.bibliographicCitation2. Z. Kordiboroujeni and J. Bornemann. Designing the width of substrate integrated waveguide structures. IEEE Microwave and Wireless Components Letters, 23(10):518-520, October 2013.en_US
dc.identifier.bibliographicCitation3. Z. Kordiboroujeni and J. Bornemann. New wideband transition from microstrip line to substrate integrated waveguide. IEEE Transactions on Microwave Theory and Techniques, 2014, In press.en_US
dc.identifier.bibliographicCitation4. Z. Kordiboroujeni and J. Bornemann. Mode-matching analysis and design of substrate integrated waveguide T-junction diplexer and corner filter. International Journal of Numerical Modelling: Electronic Networks, Devices and Fields, 2014, In press.en_US
dc.identifier.bibliographicCitation5. Z. Kordiboroujeni, J. Bornemann, and T. Sieverding. Mode-matching design of substrate-integrated waveguide couplers. Proceedings of Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), pages 701-704, Singapore, May 2012.en_US
dc.identifier.bibliographicCitation6. Z. Kordiboroujeni, F. Taringou, and J. Bornemann. Efficient mode-matching design of substrate-integrated waveguide filters. Proceedings of 42nd European Microwave Conference (EuMC), pages 253-256, Amsterdam, The Netherlands, Oct./ Nov. 2012.en_US
dc.identifier.bibliographicCitation7. Z. Kordiboroujeni and J. Bornemann. Efficient design of substrate integrated waveguide power dividers for antenna feed systems. Proceedings of 7th European Conference on Antennas and Propagation (EuCAP), pages 352-356, Gothenburg, Sweden, April 2013.en_US
dc.identifier.bibliographicCitation8. L. Locke, Z. Kordiboroujeni, J. Bornemann, and S. Claude. Substrate integrated waveguide couplers for tapered slot antennas in adaptive receiver applications. Proceedings of 7th European Conference on Antennas and Propagation (EuCAP), pages 2865-2869, Gothenburg, Sweden, April 2013.en_US
dc.identifier.bibliographicCitation9. Z. Kordiboroujeni and J. Bornemann. Mode matching design of substrate integrated waveguide diplexers. IEEE MTT-S International Microwave Symposium (IMS) Digest, pages 1-3, Seattle, WA, USA, June 2013.en_US
dc.identifier.bibliographicCitation10. Z. Kordiboroujeni, J. Bornemann and T. Sieverding. K-Band substrate integrated waveguide T-junction diplexer design by mode-matching techniques. Asia-Pacific Microwave Conference (APMC), Sendai, Japan, Nov. 2014.en_US
dc.rights.tempAvailable to the World Wide Weben_US
dc.subjectSubstrate Integrated Waveguide (SIW)en_US
dc.subjectMode Matching Techniques (MMT)en_US
dc.subjectPower Divideren_US
dc.titleMode Matching Analysis and Design of Substrate Integrated Waveguide Componentsen_US


Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
15.81 MB
Adobe Portable Document Format
License bundle
Now showing 1 - 1 of 1
No Thumbnail Available
1.74 KB
Item-specific license agreed upon to submission