Integrated silicon technology and hardware design techniques for ultra-wideband and next generation wireless systems




Huo, Yiming

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The last two decades have witnessed the CMOS processes and design techniques develop and prosper with unprecedented speed. They have been widely employed in contemporary integrated circuit (IC) commercial products resulting in highly added value. Tremendous e orts have been devoted to extend and optimize the CMOS process and its application for future wireless communication systems. Meanwhile, the last twenty years have also seen the fast booming of the wireless communication technology typically characterized by the mobile communication technology, WLAN technology, WPAN technology, etc. Nowadays, the spectral resource is getting increasingly scarce, particularly over the frequency from 0.7 to 6 GHz, whether the employed frequency band is licensed or not. To combat this dilemma, the ultra wideband (UWB) technology emerges to provide a promising solution for short-range wireless communication while using an unlicensed wide band in an overlay manner. Another trend of obtaining more spectrum is moving upwards to higher frequency bands. The WiFi-Alliance has already developed a certi cation program of the 60-GHz band. On the other side, millimeterwave (mmWave) frequency bands such as 28-GHz, 38-GHz, and 71-GHz are likely to be licensed for next generation wireless communication networks. This new trend poses both a challenge and opportunity for the mmWave integrated circuits design. This thesis combines the state-of-the-art IC and hardware technologies and design techniques to implement and propose UWB and 5G prototyping systems. First of all, by giving a thorough analysis of a transmitted reference pulse cluster (TRPC) scheme and mathematical modeling, a TRPC-UWB transceiver structure is proposed and its features and speci cations are derived. Following that, the detailed design, fabrication and veri cation of the TRPC-UWB transmitter front end and wideband voltage-controlled oscillators (VCOs) in CMOS process is presented. The TRPCUWB transmitter demonstrates a state-of-the-art energy e ciency of 38.4 pJ/pulse. Secondly, a novel system architecture named distributed phased array based MIMO (DPA-MIMO) is proposed as a solution to overcome design challenges for the future 5G cellular user equipment (UE) design. In addition, a prototyping design of on-chip mmWave antenna with radiation e ciency enhancement is presented for the IEEE 802.11ad application. Furthermore, two wideband K-band VCO prototypes based on two di erent topologies are designed and fabricated in a standard CMOS process. They both show good performance at center frequencies of 22.3 and 26.1 GHz. Finally, two CMOS mmWave VCO prototypes working at the potential future 5G frequency bands are presented with measurement results.



UWB, Next Generation, Wireless Communication, CMOS, Silicon, 5G, Voltage-controlled Oscillator (VCO), Apple Inc., Low Noise Amplifier, User Equipment, Base Station, Transmitter, Receiver, Antenna, System-on-Chip (SoC), PCB, Millimeter Wave