Design of grasping interface for microgrippers and micro-parts used in the microassembly of MEMS




Dechev, Nikolai
Cleghorn, William L.
Mills, James K.

Journal Title

Journal ISSN

Volume Title


Institute of Electrical and Electronics Engineers (IEEE)


This paper presents guidelines for designing the grasping interface between passive, surface micromachined microgrippers and micro-parts used for a microassembly system. The microassembly system is based on a robotic workstation, to which a microgripper is bonded. The workstation is capable of sequentially assembling surface micromachined micro-parts into 3D microstructures. The microgrippers and micro-parts are designed in such a way, that they each have corresponding geometrical features, which allow them to interface with each other. Previously, this work demonstrated the use of a standardized microgripper tip, and the corresponding micro-part interface feature. However, there are situations when the standardized interface feature may be undesirable for a particular micro-part, or may interfere with the performance of a microstructure. Therefore, a set of new design guidelines are presented to modularize the design of the microgrippers tips and the corresponding micro-part interface features. By using the modular design, microgrippers can be tailored to grasp specific types of micro-parts, without the need for a standardized interface feature. An example of the new modular system is provided.


©2005 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.


Microassembly, Microgripper, Micro-part, 3D, MEMS, Microstructure


N. Dechev, W.L. Cleghorn, and James K. Mills, “Design of Grasping Interface for Microgrippers and Micro-Parts Used in the Microassembly of MEMS,” Proceedings of the IEEE International Conference on Image Acquisition, Chinese University of Hong Kong, Hong Kong and Macau, China, June 27–July 3, 2005.