Microassembly of 3-D microstructures using a compliant, passive microgripper
Date
2004-04
Authors
Dechev, Nikolai
Cleghorn, William L.
Mills, James K.
Journal Title
Journal ISSN
Volume Title
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Abstract
This paper describes a novel microassembly system that can be used to construct out-of-plane three-dimensional (3-D) microstructures. The system makes use of a surface-micromachined microgripper that is solder bonded to a robotic manipulator. The microgripper is able to grasp a micropart, remove it from the chip, reorient it about two independent axes, translate it along the x, y and z axes to a secondary location, and join it to another micropart. In this way, out-of-plane 3-D microstructures can be assembled from a set of initially planar and parallel surface micromachined microparts. The microgripper is 380 x 410 um in size. It utilizes three geometric features for operation: 1) compliant beams to allow for deflection at the grasping tips; 2) self-tightening geometry during grasping; and 3) 3-D interlocking geometry to secure a micropart after the grasp. Each micropart has three geometric features built into its body. The first is the interlock interface feature that allows it to be grasped by the microgripper. The second is a tether feature that secures the micropart to the substrate, and breaks away after the microgripper has grasped the micropart. The third is the snap-lock feature, which is used to join the micropart to other microparts.
Description
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Keywords
microelectromechanical systems, MEMS, microassembly, microgripper, microstructure, micropart, snap-lock microjoint, three-dimensional (3-D), compliant, joint
Citation
N. Dechev, W.L. Cleghorn, and James K. Mills, “Microassembly of 3D Microstructures Using a Compliant, Passive Microgripper,” Journal of Microelectromechanical Systems, Vol. 13, No. 2, pp. 176-189, April 2004.