Microassembly of 3-D microstructures using a compliant, passive microgripper

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dc.contributor.authorDechev, Nikolai
dc.contributor.authorCleghorn, William L.
dc.contributor.authorMills, James K.
dc.date.accessioned2008-04-22T18:35:57Z
dc.date.available2008-04-22T18:35:57Z
dc.date.copyright2004
dc.date.issued2004-04
dc.description©2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.en_US
dc.description.abstractThis paper describes a novel microassembly system that can be used to construct out-of-plane three-dimensional (3-D) microstructures. The system makes use of a surface-micromachined microgripper that is solder bonded to a robotic manipulator. The microgripper is able to grasp a micropart, remove it from the chip, reorient it about two independent axes, translate it along the x, y and z axes to a secondary location, and join it to another micropart. In this way, out-of-plane 3-D microstructures can be assembled from a set of initially planar and parallel surface micromachined microparts. The microgripper is 380 x 410 um in size. It utilizes three geometric features for operation: 1) compliant beams to allow for deflection at the grasping tips; 2) self-tightening geometry during grasping; and 3) 3-D interlocking geometry to secure a micropart after the grasp. Each micropart has three geometric features built into its body. The first is the interlock interface feature that allows it to be grasped by the microgripper. The second is a tether feature that secures the micropart to the substrate, and breaks away after the microgripper has grasped the micropart. The third is the snap-lock feature, which is used to join the micropart to other microparts.en_US
dc.description.sponsorshipNatural Sciences and Engineering Research Council of Canada (NSERC) Canadian Microelectronics Corporation (CMC)en_US
dc.identifier.citationN. Dechev, W.L. Cleghorn, and James K. Mills, “Microassembly of 3D Microstructures Using a Compliant, Passive Microgripper,” Journal of Microelectromechanical Systems, Vol. 13, No. 2, pp. 176-189, April 2004.en_US
dc.identifier.otherDOI 10.1109/JMEMS.2004.825311
dc.identifier.urihttp://hdl.handle.net/1828/886
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.subjectmicroelectromechanical systems
dc.subjectMEMS
dc.subjectmicroassembly
dc.subjectmicrogripper
dc.subjectmicrostructure
dc.subjectmicropart
dc.subjectsnap-lock microjoint
dc.subjectthree-dimensional (3-D)
dc.subjectcompliant
dc.subjectjoint
dc.subject.departmentDepartment of Mechanical Engineering
dc.titleMicroassembly of 3-D microstructures using a compliant, passive microgripperen_US
dc.typeArticleen_US

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